Heat Transfer Compounds

Shin-Etsu Heat Transfer Compound - G751 is used for ensuring a good heat conductive bond between a PC CPU and its heat sink. It can also be used on the GPU and other temperature sensitive components

This product has a thermal conductivity (W/m °K) of 4.5. It has a specific gravity of 2.51 and vicosity of 400. This item can be used on more uneven surfaces as it is thicker than the other products.

Shin-Etsu Heat Transfer Compound - X23-7762 A very high specification thermal product used for ensuring a good heat conductive bond between a PC processor and its heat sink and other temperature sensitive components.

This product has a thermal conductivity (W/m °K) of 6.0. a specific gravity of 2.6 and vicosity of 180.

Shin-Etsu Heat Transfer Compound - X23-7783D A top quality thermal grease used for ensuring a good heat conductive bond between a PC processor and its heat sink and other temperature sensitive components.

This product has a thermal conductivity (W/m °K) of 6.0. a specific gravity of 2.6 and vicosity of 200.