Shin-Etsu Two-Component (Three- Component) RTV Rubbers

Chiltern Connections Ltd is the UK supplier for the full range of Shin-Etsu RTV Rubbers. Please find below a brief description of these products.

For a complete description of these products please click here

To purchase a Silicone RTV or for further information or discussion about the suitability of a particular product please contact our sales department here or click on the appropriate link below.

Click here to visit One-Component RTV Silicone Rubbers

 Primary application and characteristics    Grade    Cure type (by-product gas)    Brief description   Sealing Coating Potting Thermally conductive
 General Electrical Purpose KE103  Addition cure  Transparent rubber, will cure at room temperature    O    
KE108  Condensation cure (alcohol)  Transparent rubber, will cure at room temperature    O    
KE119  Condensation cure (alcohol)  Potting, high hardness    O    
KE66  Condensation cure (alcohol)  Potting, self-bonding  O O O  
KE200  Condensation cure (acetone)  Rapid-cure potting, self-bonding, reduced LMW siloxane  O   O  
KE1800T(A/B)  Addition cure  Translucent rubber, adhesive  O      
KE1031(A/B)  Addition cure  Transparent rubber, adhesive  O O O  
KE1051J(A/B)  Addition cure  Transparent gel, high viscosity, will cure at room temperature      O  
KE1052(A/B)  Addition cure  Transparent gel, will cure at room temperature      O  
KE106  Addition cure  Transparent rubber, high hardness      O  
KE109(A/B)  Addition cure  Transparent rubber, adhesive    O O  
KE118  Condensation cure (alcohol)  Self-bonding  O   O  
 Non-flammable (UL certified  product)KE1204(A/B)  Addition cure  Reduced LMW siloxane      O  
KE1204(AL/BL)  Addition cure  Low viscosity, reduced LMW siloxane      O  
KE1281(A/B)  Addition cure  Adhesive, low hardness, reduced LMW siloxane  O   O  
KE1800(A/B/C)  Addition cure  Adhesive, high hardness  O      
KE1801(A/B/C)  Addition cure  Adhesive, high hardness  O      
KE1802(A/B/C)  Addition cure  Adhesive, high hardness  O      
Foaming KE513(A/B)  Condensation cure (hydrogen)  Filling, foaming, triple-volume foam  O      
KE521(A/B)  Addition cure (hydrogen)  Filling, foaming, triple-volume foam  O      
 Thermal conductivity   KE1223  Addition cure  Thermal conductivity (0.9 W/m·K), low viscosity  O   O O
KE1861(A/B)  Addition cure  Adhesive, Thermal conductivity (1W/m·K)  O   O O